KLEVV Unveils Next-Gen DDR5 Memory and Graphene-Copper SSDs at COMPUTEX 2025

Essencore’s consumer brand KLEVV is showcasing its latest high-performance memory and storage solutions at COMPUTEX Taipei 2025, featuring new aesthetics and breakthrough speeds exceeding 10,000MT/s.

Essencore and its consumer memory brand KLEVV are presenting their latest innovations at COMPUTEX Taipei 2025, running from May 20th to May 23rd at the Taipei Nangang Exhibition Center. The showcase features significant upgrades across their product lines, with live demonstrations of cutting-edge memory and storage solutions.

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Visitors to the exhibition can witness KLEVV’s next-generation DDR5 modules running at speeds exceeding 10,000MT/s on premium motherboards from leading vendors. This demonstration highlights the performance capabilities of KLEVV’s upgraded gaming memory lineup, which now features faster speeds and lower latencies for demanding gaming and high-performance computing needs.

The aesthetic appeal of KLEVV’s products has also received attention, with the debut of the GENUINE V RGB DDR5 memory in a new black-copper finish. The URBANE V series expands with additional color options, including a Black RGB version and a Charcoal Gray non-RGB variant, providing users with more customization choices.

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Making their first public appearance are KLEVV’s latest SSDs featuring new graphene-copper heatsinks, combining efficient cooling with premium aesthetics. Moreover, the lineup is led by the flagship GENUINE G530 PCIe Gen5 SSD, accompanied by two high-performance Gen4 models: the CRAS 925G and CRAS C910G, designed for gaming, content creation, and multitasking workflows.

The exhibition also features KLEVV’s DDR5 OC CU-DIMM with CKD IC for overclockers, alongside LPDDR5X-based LPCAMM2 memory for mobile applications, demonstrated on both a laptop and a dedicated testing platform. Essencore is additionally showcasing advanced component solutions, including the 321-layer V9 TLC NAND Flash IC, UFS 2.2 and eMMC 5.1 storage solutions for embedded and mobile devices, and high-speed DRAM ICs such as the 1b nm 32Gb DDR5-7200 and 1c nm 16Gb DDR5-7200.